IEC 60191-6-22 Ed. 1.0 b:2012 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FL

standard by International Electrotechnical Commission, 12/11/2012

Full Description

IEC 60191-6-22:2012 provides the outline drawings and dimensions common to silicon-based package structures and materials of ball grid array packages (BGA) and land grid array packages (LGA).

Product Details

Edition: 1.0 Published: 12/11/2012 Number of Pages: 34 File Size: 1 file , 380 KB