IEC 60191-4 Ed. 3.0 b:2013 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

standard by International Electrotechnical Commission, 10/10/2013

Full Description

IEC 60191-4:2013 specifies a method for the designation of package outlines and for the classification of forms of package outlines for semiconductor devices and a systematic method for generating universal descriptive designators for semiconductor device packages. The descriptive designator provides a useful communication tool but has no implied control for assuring package interchangeability. This edition includes the following significant technical changes with respect to the previous edition:
a) Material code "S" is added to indicate a silicon based package.
b) Description of "WL" is added to be used for general use.

Product Details

Edition: 3.0 Published: 10/10/2013 Number of Pages: 48 File Size: 1 file , 430 KB