IEC 62769-4 Ed. 2.0 b:2021 Field Device Integration (FDI) - Part 4: FDI Packages

standard by International Electrotechnical Commission, 02/05/2021

Full Description

IEC 62769-4:2021 specifies the FDI Packages. The overall FDI architecture is illustrated in Figure 1. The architectural components that are within the scope of this document have been highlighted in this figure.

Product Details

Edition: 2.0 Published: 02/05/2021 Number of Pages: 165 File Size: 1 file , 4.3 MB