Full Description

This Technical Information Paper is presented to serve as a guide in understanding the characteristics of hot melt adhesives used in packaging applications, the terms that are used to express these characteristics, and the factors that influence the adhesives performance. This TIP also serves as a guide in understanding the components of hot melt application systems and their function in the dispensing cycle.

Product Details

Published: 08/01/2007 Number of Pages: 8File Size: 1 file , 180 KB