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TIA TSB-144 2003 Edition, April 1, 2003 Adhesive Bubbles and Voids in Fiber Optic Components: Guidance, Issues and Challenges
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Description / Abstract: The bulletin is applicable to fiber optic component reliability. The document is written for fiber optic component manufacturers, as well as end-users, and was prepared by TIA Working Group FO-6.3.1, Adhesives Reliability under the cognizance of FO-6.3 SC Subcommittee on Interconnecting Devices and Passive Products.