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GMW16195 2nd Edition, May 1, 2015 Structural Bonding Tape for Clip Attachment
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Description / Abstract: Material Description. Heat curable structural bonding tape with integrated pressure sensitive adhesive. The tape is typically protected with a suitable release liner.
• Type I tape is intended for medium/high bake plants.
• Type II tape is intended for low bake plants. Contact engineering for specific plant bake schedules.
Symbols. Not applicable.
Applicability. This specification covers the durability and adhesion performance requirements for curing structural bonding tapes for exterior trim applications. The adhesive material is used primarily for the attachment of roof ditch molding clips to roof ditches. Other applications may include the attachment of appliques or other trim parts.
Remarks. This specification covers the laboratory test requirements for GM Approved Adhesive Applications (AAA), Production Part Approval Process (PPAP), processing conditions and routine quality control. In regions other than General Motors North America (GMNA), the AAA process is optional.
In addition to the substrate/adhesive/substrate combinations, approvals are also specific to the facility that does the adhesive bonding.
• Type I tape is intended for medium/high bake plants.
• Type II tape is intended for low bake plants. Contact engineering for specific plant bake schedules.
Symbols. Not applicable.
Applicability. This specification covers the durability and adhesion performance requirements for curing structural bonding tapes for exterior trim applications. The adhesive material is used primarily for the attachment of roof ditch molding clips to roof ditches. Other applications may include the attachment of appliques or other trim parts.
Remarks. This specification covers the laboratory test requirements for GM Approved Adhesive Applications (AAA), Production Part Approval Process (PPAP), processing conditions and routine quality control. In regions other than General Motors North America (GMNA), the AAA process is optional.
In addition to the substrate/adhesive/substrate combinations, approvals are also specific to the facility that does the adhesive bonding.