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ISO 9453:2006

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ISO 9453:2006 Soft solder alloys - Chemical compositions and forms

standard by International Organization for Standardization, 10/01/2006

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ISO 9453:2006 specifies the requirements for chemical composition for the following families of soft solder alloys:

tin-lead, with and without antimony, bismuth, cadmium, copper, and silver;tin-antimony;tin-bismuth;tin-copper, with and without silver;tin-indium, with and without silver and bismuth;tin-silver, with and without copper and bismuth;tin-zinc, with and without bismuth.

ISO 9453:2006 also includes an indication of the forms generally available.

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Published: 10/01/2006File Size: 1 file , 190 KB Same As: BS EN ISO 9453:2006