BS 2011-2.1TD:1990 Environmental testing. Tests. Test Td. Solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
Procedure for testing the effects of soldering using a solder bath. Applicable only to products designed to withstand short term immersion in molten solder. To be read in conjunction with Part 1.1
Replaced by BS EN 60068-2-58:1999 but remains current.
Product Details
Published: 08/31/1990 ISBN(s): 058018806X Number of Pages: 16File Size: 1 file , 4.2 MB Product Code(s): 00222184, 00222184, 00222184 Note: This product is unavailable in United Kingdom