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> IEC 62878-2-5 Ed. 1.0 b:2019
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IEC 62878-2-5 Ed. 1.0 b:2019

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IEC 62878-2-5 Ed. 1.0 b:2019 Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate

standard by International Electrotechnical Commission, 09/16/2019

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IEC 62878-2-5 defines the data format for active and passive devices embedded inside an organic board whose electrical connections are made by means of a via, electroplating, conductive paste or printing of conductive material. This PAS describes the expression of 3D data information, the concept of layers, the structure of board data, and definitions of information repeatedly used in design.

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Edition: 1.0 Published: 09/16/2019 Number of Pages: 112 File Size: 1 file , 5.8 MB