Full Description

In ASHRAE Technical Committee 9.9's Thermal Guidelines for Data Processing Environments, the environmental guidelines for IT equipment inlet conditions extended the allowable range up to 85% and 90% relative humidity (RH) and 75F (24C) dew point. However, in an unconnected parallel move, international regulators banned the use of lead-based solders within the manufacturing of electronic equipment. The lead-based solder has been replaced with silver-based solder. Unfortunately, silver, unlike lead, is more susceptible to effects of corrosion when exposed to certain environmental conditions. As a result, operating data centers at the higher humidity levels defined in the allowable ranges in Thermal Guidelines can have detrimental effects on electronic equipment reliability.

Citation: ASHRAE Journal, vol. 56, no. 12, Dec 2014